Sponsors & Supports

Host Organization

• The 141st Committee on Microbeam Analysis of JSPS

Joint Sponsors

	The Surface Science Society of Japan
	JSPS Grant-in-Aid for Scientific Research on Innovative Areas “3D Active-Site Science”
	Water Frontier Science & Technology Research Center, Research Institute for Science & Technology, Tokyo University of Science

Exhibitions & Advertisements

Gold Sponsors

	FOCUS GmbH
	JEOL Ltd.
	Scienta Omicron, Inc.
	SHIMADZU CORPORATION

Silver Sponsors

Hitachi High-Technologies Corporation

Advertisements

	HORIBA, Ltd.
	TSUJI-ELECTRONICS Co., Ltd.

	Nano Science Corporation
	Science Laboratories Inc.
	TOKYO ELETRONICS CO., LTD.
	PASCAL CO., LTD.
	VIC International Co., Ltd.

Financial Supports

• Japan Society for the Promotion of Science (JSPS)
• JSPS University-Industry Research Corporation
• The Industry Club of Japan

Supports

• The Chemical Society of Japan
• The Japan Institute of Metals and Materials
• The Japan Society for Analytical Chemistry
• The Japan Society of Applied Physics
• The Japanese Society for Synchrotron Radiation Research
• The Japanese Society of Microscopy
• The Mass Spectrometry Society of Japan
• The Physical Society of Japan
• The Society of Polymer Science, Japan
• The Spectroscopical Society of Japan
• Surface Analysis Society of Japan
• The Surface Finishing Society of Japan
• The Vacuum Society of Japan
• The 131st Committee on Thin Film of JSPS
• The 132nd Committee on Electron and Ion Beam Science and Technology of JSPS
• The 145th Committee on Processing and Characterization of Crystals of JSPS
• The 151st Committee on Advanced Nanodevice and Nanomaterial Technology of JSPS
• The 154th Committee on Semiconductor Interfaces and Their Applications of JSPS
• The 158th Committee on Vacuum Nanoelectronics of JSPS
• The 162nd Committee on Wide Bandgap Semiconductor Photonic and Electronic Devices of JSPS
• The 167th Committee on Nano-probe Technology of JSPS
• The 186th Committee on Radiation Science and Its Applications of JSPS
• The 191st Committee on Innovative Interface Bonding Technology of JSPS